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Suggested Items

My Top 7 Takeaways from APEX EXPO 2026

04/03/2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics Association
I’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

02/27/2026 | Marcy LaRont, I-Connect007 Magazine
It’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!

Growing an Engineer: Meet Emerging Engineer Julian Vega

02/25/2026 | Marcy LaRont, I-Connect007 Magazine
Julian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.

Siemens Wins Best of Show Award for ‘Packaging: Design’ at 2026 Chiplet Summit

02/23/2026 | Siemens
Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution.

FLEX Technology Summit 2026 Spotlights Augmenting Flexible Hybrid Electronics with AI, Digital Twins, and XR

01/23/2026 | SEMI
The FLEX Technology Summit will be held on February 24-26, 2026, at the Wigwam Arizona Resort in Phoenix, Arizona, celebrating 25 years of innovation in flexible hybrid electronics (FHE), printed electronics, and advanced packaging.
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