Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

AI Revolutionizing Electronics Manufacturing with Burkle

04/23/2026 | Real Time with... APEX EXPO
Explore the transformative impact of artificial intelligence on the electronics industry with Andy Turner, president and CEO of Burkle North America. Discover how AI is revolutionizing customer support, enhancing product development, and enabling scalable manufacturing solutions. Learn how Burkle leverages AI to optimize operations, improve customer satisfaction, and support entrepreneurs in achieving their business goals.

CMMC Compliance and AI Integration with Accurate Circuit Engineering

04/23/2026 | Real Time with... APEX EXPO
James Hofer of Accurate Circuit Engineering (ACE) delves into the challenges and benefits of integrating AI and meeting stringent security requirements. Discover how ACE navigates CMMC, its impact on data management, and the strategic advantages of certification for businesses.

AI, HDI, and Interconnect Optimization with MKS' ESI

04/23/2026 | Real Time with... APEX EXPO
This discussion revolves around the transformative impact of AI on HDI and substrate manufacturing. Casey Krueger explains the company's "Optimize the Interconnect" initiative, which features Atotech, to provide a comprehensive solution from pretreatment to laser drilling. MKS' ESI offers the innovative Geode G2 platform which is an advanced laser drilling technology that enhances productivity, reduces energy consumption, and addresses complex design challenges in processing both PCB and ICP materials.

Insulectro: Advanced PCB Fabrication Materials

04/23/2026 | Real Time with... APEX EXPO
Explore advanced PCB fabrication materials with Insulectro's Dain Hertsgaard and Gabriel Zepeda. This interview covers Arlon's innovative polyimide and epoxy solutions, including low-flow options for flex materials and high-performance materials for HDI applications; Qnity's polyimide films for demanding environments, and DuPont Interra's capacitance films for enhanced reliability. Insulectro offers comprehensive service and a commitment to advancing circuit technology

Advanced Electronics Packaging at APEX EXPO with Matt Kelly

04/20/2026 | Real Time with... APEX EXPO
The first advanced electronics packaging conference at APEX EXPO 2026 was well-received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association, says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year were the Design Pavilion and Technology Theater, which brought commercial value to technical discussions and highlighted the critical role of timely standards development in rapidly evolving sectors such as AI and automotive.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in