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Suggested Items

Driving Innovation: Selecting the Right Laser Source

04/28/2026 | Simon Khesin -- Column: Driving Innovation
When I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.

AI, HDI, and Interconnect Optimization with MKS' ESI

04/23/2026 | Real Time with... APEX EXPO
This discussion revolves around the transformative impact of AI on HDI and substrate manufacturing. Casey Krueger explains the company's "Optimize the Interconnect" initiative, which features Atotech, to provide a comprehensive solution from pretreatment to laser drilling. MKS' ESI offers the innovative Geode G2 platform which is an advanced laser drilling technology that enhances productivity, reduces energy consumption, and addresses complex design challenges in processing both PCB and ICP materials.

Horizon Sales Adds LPKF Laser and Electronics to Its Lineup

04/21/2026 | Horizon Sales
Horizon Sales, a leading manufacturers’ representative and distributor to the electronics industry, is pleased to announce a new partnership with LPKF Laser and Electronics, a global leader in precision laser technology

Future-proof Laser Depaneling for PCBs with Photonics

04/10/2026 | Real Time with... APEX EXPO
Bill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.

CEA-Leti, NcodiN Partner to Industrialize 300 mm Silicon Photonics

03/11/2026 | NcodiN
CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process.
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