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SEMI Europe Outlines Six Key Recommendations to Strengthen Chips Act 2.0

04/28/2026 | SEMI
SEMI Europe announced the publication of its Position Paper on the Chips Act 2.0, presenting a set of strategic recommendations aimed at reinforcing and future-proofing Europe’s semiconductor policy framework.

Global Electronics Association and FED Open Call for Abstracts for 2027 Pan-European Design Conference

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The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).

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EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates

04/21/2026 | Alison James and Chris Mitchell, Global Electronics Association
The European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks

SEMI Europe Policy Forum 2026 in Brussels to Focus on Chips Act 2.0

04/16/2026 | SEMI
The SEMI Europe Policy Forum Brussels 2026 to be held on June 3 will bring together industry leaders, economists, policymakers, and technology experts to examine how geopolitical dynamics are transforming the global semiconductor landscape and to identify concrete pathways for reinforcing Europe’s leadership role.
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