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TRI Highlights Advanced SEMI Inspection and Metrology Solutions at SEMICON SEA 2026
March 25, 2026 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON SEA held at MITEC, Kuala Lumpur, Malaysia from May 5 - 7, 2026.
Visit TRI's Booth No. 2149 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions. TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology,μBump, Cu Pillar, Surface Topology, Profiling, Wafer thickness, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.
TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.
TRI will also exhibit the back-end inspection solutions, the 3D SEMI AOI TR7700Q SII-S with AI-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps, Cu pillars, TGV, and more.
Visit TRI at Booth No. 2149 at SEMICON SEA 2026 to explore the future of SEMI inspection.
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