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Intervala, a full-service electronics manufacturing services (EMS) provider specializing in complex electronic and electromechanical products, announced key additions and promotions within its leadership team as the company continues to expand its capabilities across industrial technology, data center infrastructure, aerospace and defense, and medical device markets.

Getters, Thermal Management, and High-Reliability Packaging: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

06/10/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several technologies shaping the future of advanced packaging, from maintaining stable environments inside hermetic packages to managing heat in increasingly complex 3D architectures. The issue also examines packaging innovations for aerospace, defense, and automotive applications, as well as broader connections between semiconductor interconnects and the systems they support.

Powering the Future: When Material Choice Defines RF Performance

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In RF and microwave design, deciding on which materials to use determines whether your design merely works or truly performs. Yet, designers too often fall back on material selection that is familiar, available, or “good enough.” However, once you move into higher frequencies, higher power densities, and tighter performance tolerances, “good enough” becomes the very thing that holds your design back. That’s where ceramic substrates become a fundamentally different approach to solving RF challenges.

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Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications:

Pembroke Instruments Launches Thermal Imaging Microscope for Semiconductor Failure Analysis

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Pembroke Instruments, LLC announced the availability of its integrated Thermal Imaging Microscope platform designed for electronics testing, semiconductor failure analysis, PCB inspection, solar cell evaluation, battery analysis, and advanced materials research.
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