Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

First Mold Expands University Partnerships to Build Next-Generation Manufacturing Talent Pipeline

06/05/2026 | PRNewswire
First Mold announced a long-term partnership with learning institutions, including universities, to enhance the development of skilled talent within their systems.

Mobix Labs to Acquire U.S.-Built Drone Manufacturer Vision Aerial

06/05/2026 | BUSINESS WIRE
Mobix Labs, Inc. announced that it has signed a binding Letter of Intent to acquire Vision Aerial, Inc., a Montana-based manufacturer of American-built drones trusted in national security, government, energy, public safety, and critical infrastructure operations.

Road to Reliability: The Foundational Technologies of Materials in EV Reliability

06/04/2026 | Stanton Rak, SF Rak Company
EV reliability is often discussed at the vehicle or system level, but many of the most persistent failures begin at the materials level. Semiconductor devices, ceramic substrates, die attach materials, wire bonds, clips, thermal interface materials, laminates, coatings, seals, and coolants define the electrical, thermal, and mechanical limits of the hardware. Once EV architectures move toward higher voltages, switching speeds, and power density, and longer service life, those materials are pushed harder, and small weaknesses can turn into large field problems

Indium, Ames National Laboratory Team Up to Establish U.S. Gallium Supply Chain

06/03/2026 | Indium Corporation
Indium Corporation® and Ames National Laboratory have announced a research and development partnership to expand U.S. production of gallium, a critical material used in semiconductors and electronics, including smartphones, LED lighting, and optoelectronics.

Will Gutierrez Joins Technica USA in West South-Central Territory

06/02/2026 | Technica USA
Technica USA is pleased to announce the hiring of Will Gutierrez as Business Development/Account Manager responsible for the West South-Central Territory. Will shall be responsible for all PCBA, Substrate and PCB related sales activities and customer support throughout Texas, Oklahoma, Arkansas and Louisiana operating from the state of Texas.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in