Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Zhen Ding Highlights AI and Global Mass Production in Advanced PCB Competition

10/23/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leader in PCB manufacturing, participated in the “TPCA Show Trends Forum” at the 2026 TPCA Show.

Global Electronics Association Hosts IMPACT 2026 Session on Advanced Electronic Packaging System Integration, with Technical Perspectives from Unimicron, STATS ChipPAC and Wistron

10/22/2026 | Global Electronics Association
The Global Electronics Association hosted the session "Advancements in Component to System Integration" at IMPACT 2026, bringing together Unimicron, STATS ChipPAC, Wistron and market research firm TechSearch International.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/23/2026 | Marcy LaRont, I-Connect007
In my top five must-read items from this week’s articles and news, I am focusing on the interconnect because, honestly, who isn’t? We are in the interconnect business, and it just gets more complex and more fun every day. My interview with MKS Inc.’s Dr. John Lee and the accompanying article, which breaks down the technology, implications of current market realities, and their effect on the state of “the interconnect,” is my first choice this week.

Zhen Ding: AI Reshapes High-End PCB Competition

10/22/2026 | Zhen Ding
Zhen Ding Technology Holding Limited, a global leader in PCB manufacturing, participated in the “TPCA Show Trends Forum” at the 2026 TPCA Show.

TTM Technologies Reports Record Q3 2026 Sales of $1.2 Billion, Up 60% YoY

10/22/2026 | Globe Newswire
Net sales in the third quarter of 2026 were $1.2 billion, compared to $752.7 million in the third quarter of 2025.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in