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Smart Textile Integration with Flex PCBs

08/10/2026 | Anaya Vardya, American Standard Circuits
The idea of clothing that monitors your health sounds like science fiction. It is not. Flex PCBs, integrated with conductive yarns and polymer substrates, are turning ordinary fabric into diagnostic platforms and turning your shirt into a medical device. The implications for healthcare, athletics, and workplace safety are profound. The fundamental engineering challenge of wearable electronics has always been the interface between two incompatible worlds: the rigid, planar world of conventional electronics and the soft, stretchy, washable world of textiles. Early smart garments solved this by simply attaching a rigid sensor pod to clothing, which was functional but bulky and uncomfortable. Flex PCBs collapse that boundary.

Powering the Future: Performance Is Won in Assembly

08/05/2026 | Brian Buyea -- Column: Powering the Future
There’s a moment in every design cycle when the conversation shifts from the elements of a substrate—material selection, thermal conductivity, circuit density, layout, and performance on paper—to how it performs in assembly. No matter how good your substrate is, if the assembly isn’t right, none of it matters. Engineers are coming to terms with the fact that performance is more than the circuit. It’s now about the system, and that’s where assembly stops being an afterthought and becomes the whole game.

Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.

Sumitomo Chemical Subsidiary to Establish of a Joint Venture with Samsung Electro-Mechanics for the Glass Core Substrate Business

07/13/2026 | Sumitomo Chemical
Sumitomo Chemical today announced that its wholly owned Korean subsidiary, Dongwoo Fine-Chem Co., Ltd. , has signed a joint venture agreement with Samsung Electro-Mechanics Co., Ltd. to establish a joint venture company that will engage in the business of glass core substrates for advanced semiconductor packages.

ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging

07/07/2026 | BUSINESS WIRE
Advanced Chip and Circuit Materials (ACCM) introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match the in-plane coefficient of thermal expansion of silicon while running on established organic-substrate manufacturing lines.
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