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At the Annual General Meeting of Cicor Technologies Ltd. in Zurich, the shareholders approved all proposals.

FlashPCB Names Matthew Belknap Production Manager as Operations Continue to Ramp

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FlashPCB, a leading provider of quick-turn PCB assembly, has promoted Matthew Belknap to Production Manager, following his recent start with the company earlier this year.

EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates

04/21/2026 | Alison James and Chris Mitchell, Global Electronics Association
The European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks

The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation

04/21/2026 | Steve Williams -- Column: The Right Approach
The Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.

Zhen Ding Board Approves Subsidiary Leading Technology’s Hong Kong Listing Plan

04/20/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced (17th) that its Board of Directors has approved a proposal for its subsidiary, Leading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd., to apply for a listing on the Hong Kong Stock Exchange.
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