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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

TTM Building the Infrastructure Around the Chip

09/17/2026 | Nolan Johnson, I-Connect007
TTM Technologies’ new UHDI facility in Syracuse, New York, provides a starting point for a broader conversation with President and CEO Edwin Roks about the future of advanced electronics manufacturing. Roks discusses his optimism for the growing demand for finer-feature PCBs, the move toward semiconductor-level dimensions, and the role of substrates, UHDI, and heterogeneous packaging in building the next generation of electronic systems.

SEMI Calls for Chips Act 2.0 to Boost Semiconductor Competitiveness

09/14/2026 | SEMI
SEMI renews its call on European policymakers to use the proposed Chips Act 2.0 to strengthen Europe’s semiconductor competitiveness, reinforce supply chain resilience, and create the conditions needed to attract and sustain investment across the entire semiconductor value chain.

Rigetti Signs $100M U.S. Government Agreement for Quantum R&D

09/11/2026 | Globe Newswire
Rigetti Computing, Inc., a pioneer in full-stack quantum-classical computing, announced that its wholly owned subsidiary, Rigetti & Co, LLC, has signed a definitive agreement with the U.S. Department of Commerce for an award of $100 million in funding to accelerate superconducting quantum computing R&D.

Semiconductor Design Market to Reach $69.43B by 2035

09/10/2026 | Globe Newswire
According to SNS Insider, the global Semiconductor Design Market was valued at $25.23 Billion in 2025 and is projected to reach USD 69.43 Billion by 2035, registering a CAGR of 10.67% from 2026 to 2035.

Samsung, Mistral AI Partner on Semiconductor Infrastructure

09/09/2026 | BUSINESS WIRE
Samsung Electronics Co., Ltd., announced it has entered into a strategic partnership with Mistral AI to enhance its semiconductor engineering and manufacturing capabilities that will reinforce its leadership in AI chip technologies.
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