Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense
Defense Speak Interpreted: Hypersonics Report Back After Six Years of Silence
American Made Advocacy: American Microelectronics Power the Future of High Technology
Real Time with... APEX EXPO 2026: Remtec Expands Microelectronics Assembly
February 25, 2026 | Real Time with... APEX EXPOEstimated reading time: Less than a minute
Julio Castillo and Chris Dougherty from Remtec discuss their expanded capabilities in microelectronic assembly, including chip and wire and multi-chip module component attachment. They highlight their expertise in ceramic substrates for high-reliability, high-power, and harsh environment applications, offering integrated solutions.
Experts will be present in Remtec's booth, #4429, to discuss these capabilities.
Look for more interviews with industry experts leading up to APEX EXPO 2026, special show coverage after the event on the Real Time with... APEX EXPO 2026 website and in our new Show & Tell Newsletter, sent to your inbox on Fridays starting March 27.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
04/17/2026 | Real Time with... APEX EXPOAt APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.
At KYZEN, Cleaning is All About Reliability
04/17/2026 | Real Time with... APEX EXPOJason Schwartz discusses KYZEN's advanced cleaning solutions for PCB assembly with Dan Beaulieu at APEX EXPO 2026. KYZEN has a 35-year legacy in defluxing, innovative real-time process control, and commitment to ensuring electronic reliability. How KYZEN partners with manufacturers through process audits and lab testing to maintain optimal cleaning standards is part of this conversation.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.