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Rewriting Metallization, One Ink at a Time

06/09/2026 | Marcy LaRont, I-Connect007 Magazine
Additive manufacturing has long promised to reshape how electronics are built, but that promise has remained just out of reach for many in the PCB industry who are limited by materials, performance trade-offs, and real-world manufacturability. Electroninks aims to change that equation by rethinking metallization at the chemical level by developing metal-complex inks that challenge established approaches and open new possibilities for advanced packaging, interconnects, and beyond.

Trouble in Your Tank: Understanding Interconnect Defects, Part 2

12/03/2025 | Michael Carano -- Column: Trouble in Your Tank
Part 1 of this two-part series presented a more detailed look at the underlying causes of interconnect defects (sometimes known as interplane separation), with these three modes of interplane separation: Type 1: Separation of the electroless copper deposit from the interconnect; Type 2: Separation of the electrolytic copper deposit from the electroless copper deposit, but the electroless remains on the post; Type 3: Cohesive failure of the electroless, whereby the electroless copper deposit actually separates from itself.

Trouble in Your Tank: Understanding Interconnect Defects, Part 1

11/04/2025 | Michael Carano -- Column: Trouble in Your Tank
This month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.

JSR/Inpria, Lam Research Enter Cross Licensing and Collaboration Agreement to Advance Semiconductor Manufacturing

09/16/2025 | JCN Newswire
JSR Corporation, a leading technology company focused on material innovation and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, Lam Research Corp., a global leader in semiconductor fabrication equipment and services, announced that JSR/Inpria and Lam have entered into a non-exclusive cross-licensing and collaboration agreement to advance leading-edge semiconductor manufacturing.

Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress

08/04/2025 | Michael Carano -- Column: Trouble in Your Tank
Metallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
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