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I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
February 12, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
I-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test.
Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics. With a sharp focus on substrates, ceramics, and packaging fundamentals, he will guide readers inside the package to examine how early engineering decisions shape RF behavior, thermal management, reliability, and long-term system performance.
Drawing on his experience at Remtec, a leader in advanced ceramic substrates and metallized circuit solutions, Gupta brings a calm, authoritative voice to complex topics that are often misunderstood or oversimplified. Each installment returns to first principles, reinforcing a core truth of advanced electronics: performance is engineered, layer by layer, decision by decision.
Below the Surface will speak to engineers, managers, and decision-makers alike. More than learning what works, you’ll understand why it works, where assumptions quietly break down, and how choices made early and often invisibly in the design process define success or failure downstream.
The column will address high-reliability markets where credibility is earned through experience, clarity, and respect for physics. Below the Surface seeks to consistently answer one essential question for the electronics industry: Where does performance really begin, and how do you get it right the first time?
Gupta’s column will debut in the Daily Newsletter for I-Connect007.
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