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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

Charles Wert Named President of ASC Sunstone Circuits

08/17/2026 | American Standard Circuits
Anaya Vardya, CEO of American Standard Circuits and ASC Sunstone Circuits, has announced the appointment of Charles Wert as President of ASC Sunstone Circuits.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/14/2026 | Marcy LaRont, I-Connect007
Another week has flown by, and it’s time for the must-read articles and news highlights. This week, I’m putting a spotlight on FUJI PCB and FS Quality, through an interview by Dan Beaulieu with President Tianming Liu, and “the rest of the story” from the EIPC Summer Conference technical sessions. I’m also focusing on a new marketing book by Brittany Martin, and there’s rarely a week when we don’t talk about AI, so I also chose Sean Patterson’s most recent practical advice for PCB fabricators. Though the U.S. has placed a “stay” on CMMC Level 2 certification, it’s still coming for you and your business. If you work in the Mil/Aero space in the U.S., check out what Omega EMS has done to accelerate its compliance. Their wisdom may be worth your time.

Carano and ElectronicsU Debut New Course on Advanced Packaging

08/13/2026 | Nolan Johnson, I-Connect007
Mike Carano is an industry pioneer with deep expertise across multiple domains. In his latest course for the Global Electronics Association’s ElectronicsU platform, “Advanced Packaging: HDI Enabling Technology,” Carano delivers some of the first educational material introducing advanced packaging to the printed circuit supply chain. In this interview, he discusses the course content, target audience, and motivation for creating the course. 

Omega EMS Advances Toward CMMC Level 2 Certification

08/12/2026 | Nolan Johnson, SMT007 Magazine
In June, Omega EMS announced its intention to achieve CMMC Level 2 before the U.S. Department of Defense’s mandatory November 2026 implementation timeline for organizations handling Controlled Unclassified Information (CUI). We caught up with Omega EMS CEO Chris Alessio to discuss the company’s certification journey, the investment required, and what CMMC means for Omega’s military and aerospace business. Note: The DoD has suspended its November requirement pending a 60-day review.
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