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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/17/2026 | Nolan Johnson, SMT007 Magazine
The Pentagon’s announcement on Tuesday that CMMC certification is being immediately suspended is the big news of the week. We’ve been covering the CMMC journey since the beginning, and we’ll stick with the story for the duration. If you’ve followed my list of must-reads, you know that I’m always interested in semiconductor news, and this week had a few good ones. I’ll mention them here, and urge you to read the entire stories: Apple adds to the recent Intel fab agreement by adding to its U.S.-based design and manufacturing agreement with Broadcom; Micron is investing $3 billion to the U.S. semiconductor ecosystem; and Intel announces a 5 billion euro investment in European infrastructure.

Keysight, Sateliot Selected by ESA to Develop Blockchain-Enabled 5G NTN Framework

07/16/2026 | BUSINESS WIRE
Keysight Technologies, Inc. has been selected by the European Space Agency (ESA) to lead a three‑year development program focused on creating secure, blockchain‑enabled anomaly detection for 5G non‑terrestrial networks (NTN).

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.

CIL Awarded Investors in People

07/14/2026 | CIL
Custom Interconnect Ltd (CIL), a leading provider of Outsourced Semiconductor Packaging and Test (OSAT), EMS and full product build solutions, is proud to announce that it has been awarded the highly respected Investors in People (IIP) Accreditation, recognising the company's commitment to supporting, developing, and empowering its employees.

Meet the Author Podcast: Exploring the Growing Role of UV Curable Conformal Coatings with Dow

07/13/2026 | I-Connect007
UV curable conformal coatings are gaining momentum for good reason. Faster processing, simplified manufacturing, and improved reliability have made the technology an attractive option for electronics manufacturers looking to improve production without sacrificing performance. In the latest Meet the Author podcast from I-Connect007, Managing Editor Nolan Johnson welcomes Brian J. Chislea and Cody Schoener, PhD, of Dow, Inc. to discuss their new book, The Printed Circuit Designer's Guide to... UV Curable Conformal Coatings.
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