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Advanced Electronics Packaging Digest

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Benchmark to Ring NYSE Closing Bell

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Benchmark Electronics, Inc., a global provider of engineering, design and manufacturing services, announced that President and Chief Executive Officer David Moezidis and his senior leadership team will participate in the Closing Bell ceremony at the New York Stock Exchange (NYSE) on Monday, November 2, 2026, at 4:00 p.m. ET, celebrating the company's 30th year on the exchange.

AI Networking and Interconnect Market Projected to Reach US$279.8 Billion in 2027

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TTM Completes 2025 Buyback, Authorizes New $100M Repurchase Program

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TTM Technologies, Inc. announced it has completed its existing authorized share repurchase program, which was previously announced on May 8, 2025.

OLED Notebook Shipments Forecast to Grow 40% in 2027 Amid New MacBook Pro Launch

10/29/2026 | TrendForce
Apple’s newly unveiled MacBook Pro with PROLED XDR Display marks a significant milestone in the evolution of MacBook display technology and user experience, becoming the first model in the lineup to feature a tandem OLED touchscreen.

Amphenol Reports Record Q3 Results, Raises Dividend

10/29/2026 | BUSINESS WIRE
The Company continues to deploy its financial strength in a variety of ways to increase shareholder value. During the third quarter, the Company purchased 3.0 million shares of its common stock for $245 million and paid dividends of $308 million, resulting in total capital returned to shareholders of $553 million.
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