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Removing the Bottleneck: ZOT's Transition to Direct Imaging

08/05/2026 | Marcy LaRont, I-Connect007
For many PCB fabricators, solder mask imaging can become one of the biggest constraints on production. Traditional exposure methods often involve lengthy setup times, multiple process steps, and opportunities for registration errors, leading to costly rework. ZOT Engineering Ltd., a UK-based contract electronics manufacturer specializing in PCB fabrication and assembly, recently modernized this part of its process by partnering with Schmoll Maschinen to deploy a maskless direct imaging (MDI) system. We spoke with Karan Khanuja, a senior process engineer at ZOT, about the challenges they faced, how they evaluated the technology, and what changed after implementation.

The Chemical Connection: When History Repeats Itself on Diversification

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Diversification, as a way to spread out risks, maintain steady cash flows, and sustain stable earnings in unpredictable business environments, is a concept that has long been used by all businesses, not just PCB fabrication. Is it really a sound business approach? With the benefit of 20/20 hindsight afforded by over 50 years of experience in the PC fab business, I have formed some definite opinions and observations on this subject, which I will now share with you (with some caveats).

Summit Interconnect Celebrates 10 Years

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Ten years ago, Shane Whiteside had a vision for the dwindling North American PCB industry: to develop a company at scale that would put North American PCB manufacturing back on the map. The result was the combination of six PCB organizations and complementary businesses to create Summit Interconnect, now the second-largest PCB manufacturer in North America. In this interview, Summit CEO Shane Whiteside and Vice President of Technology Gerry Partida reflect on Summit's 10th anniversary, the pride they take in what they've built, and the enthusiasm they still bring to the business as they celebrate this milestone.

Circularity for A Resilient Supply Chain, PFAS, and More

07/23/2026 | Marcy LaRont, I-Connect007
As governments around the world take a closer look at PFAS and other sustainability issues, electronics manufacturers face an increasingly complex regulatory landscape. In part 2 of this interview, Dr. Diana Radovan, sustainability policy director at the Global Electronics Association, shares insights on emerging PFAS policies, circularity efforts, and the global conversations shaping the industry's future.

Beyond Recycling: A Circularity Approach for a Truly Resilient Electronics Supply Chain

07/23/2026 | Marcy LaRont, I-Connect007
Dr. Diana Radovan, director of sustainability policy and sustainability advocacy lead at the Global Electronics Association, has been at the center of some of the electronics industry's most consequential policy discussions, from the European Parliament in Brussels to sustainability summits in Germany and circularity conferences across Europe. With the European Union's landmark Circular Economy Act moving closer to reality and updates to PFAS regulations, she has been ensuring that the voice of the electronics industry is heard. In this interview, she discusses what's coming, why it matters, why true circularity extends far beyond recycling, and what policymakers still need to do to enable it.
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