Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Global Electronics Association Strengthens Taiwan Technical Leadership in Advanced Electronic Packaging

08/03/2026 | Global Electronics Association
As advanced electronic packaging becomes increasingly important to enabling next-generation semiconductor innovation, including chiplet architectures, 3D integration, and advanced substrate technologies, the Global Electronics Association today announced the appointment of Jeffrey ChangBing Lee as Technology Solutions Lead Expert for Advanced Electronic Packaging (AEP) – Taiwan.

SIA Commends CHIPS Awards to Accelerate Advanced Compute Semiconductor R&D

07/30/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding seven R&D awards announced by the CHIPS Research and Development Office (CRDO) to accelerate semiconductor R&D for the advanced compute supply chain.

Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap

07/29/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.

Marvell Invests $250M in India to Expand AI Development

07/29/2026 | BUSINESS WIRE
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced plans to invest $250 million in India over the next three years to expand its capabilities across technology, talent and infrastructure.

Intel, Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era

07/27/2026 | Intel
Intel Corporation and Lens Technology announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in