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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 31, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest.
Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
In our podcast, On the Line with…, American Standard Circuits’ John Johnson drops a discussion on the role of vias in UHDI manufacturing. Marcy LaRont reports on SMTA International, and Global Electronics Association’s advocacy expert Chris Mitchell provides his analysis of the current global trade environment and its effects on electronics manufacturing.
Quick note: We’re releasing our “Spotlight on Mexico” issue of SMT007 Magazine next Monday, and it’s one to read if Mexico is at all part of your supply chain. Spoiler alert: Your supply chain probably moves through Mexico more than you know. Be sure to check out the November issue. (If you speak Spanish, you’re in for a treat!)
TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
Published October 27
AI product demand is so strong that TSMC is accelerating the rollout of its most advanced chip fab technology at its Arizona facilities. Will this be 3-nanometer, or will TSMC leapfrog to 2-nanometer? That remains to be seen.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
Published October 27
Despite the domestic production, Nvidia’s top-tier GPUs will still travel to Taiwan for advanced packaging. This is true for most semiconductors produced in the U.S. Amkor Technology’s advanced packaging plant in Arizona won’t start operating until 2027 or 2028.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
Published October 29
John Johnson explains why solder mask application is one of the most pivotal—and often underestimated—steps influencing UHDI performance and reliability. Fabricators must fine-tune their processes to fully realize UHDI’s potential and achieve lasting success in ultra-fine feature manufacturing, and John discusses how.
A New Era for Global Trade and Electronics
Published October 28, 2025
Chris Mitchell, VP of global government relations at the Global Electronics Association, discusses the effects of what appears to be a fragmentation of the long-standing WTO equilibrium. What does that mean to global trade in general and our industry in specific? Mitchell dives into the details.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
Published October 27
I-Connect007 Executive Director Marcy LaRont spent the week in Rosemont, Illinois, attending SMTA International. Read her report on the conference, the expo, and the state of the industry as viewed from a leading industry gathering.
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The Global Electronics Association Is Future Forward
04/17/2026 | Real Time with... APEX EXPOJohn W. Mitchell, CEO of the Global Electronics Association, discusses the association's comprehensive role in standards, training, sustainability, and global advocacy. He highlights the industry's critical importance and the association's efforts in workforce development and adapting to AI. The conversation also touches on future trends like personal robotics and innovative approaches to industry standards.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
Industry-Wide Memory Constraints Grow as AI-Driven Supply Shift Reshapes Market
04/13/2026 | Global Electronics AssociationArtificial Intelligence is consuming a growing share of the world’s memory supply, leaving electronics manufacturers across industries facing longer lead times, rising prices, and increasing uncertainty, according to a new report released today from the Global Electronics Association.
From Panels to Post-its
04/07/2026 | Lorena Villanueva, Global Electronics Association MexicoLast January, I attended the Global Leadership Summit of the Wire Harness Manufacturer’s Association (WHMA) in Las Vegas, and there was a subtle shift in one of the events that everyone could feel. We still had the traditional conference rhythm: strong keynote, well-prepared panels, and smart people in the room. There were also, sometimes, some careful answers—useful, but not always candid. So, I was curious when WHMA introduced a new peer-to-peer format for one session.
Global Electronics Association Announces New Board Members at APEX EXPO 2026
04/07/2026 | Global Electronics AssociationAt the 69th Global Electronics Association Annual Meeting on March 17, held in conjunction with APEX EXPO 2026, the Association’s Board of Directors announced new officers and first-term members. Board officers serve a two-year term; board members serve a three-year term, and the student board member serves a one-year term.