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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Siemens to Acquire Precision Innovations to Expand AI-Powered Chip Design Optimization

07/20/2026 | Siemens
Siemens announced that it has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software company, expanding Siemens’ EDA portfolio with AI-powered chip planning capabilities that help semiconductor teams optimize power, performance and area earlier in the system-on-chip design process.

Tower Semiconductor with METI Support Announces Strategic Capacity Expansion in Japan

07/20/2026 | Tower Semiconductor
Tower Semiconductor, a leading foundry of high-value analog semiconductor solutions, announced a parallel dual-track strategic expansion of its 300mm Silicon Photonics (SiPho), Silicon Germanium (SiGe), and advanced packaging capabilities in Japan, with support from the Government of Japan.

AI, Geopolitics Drive Southeast Asia's High-End PCB Ecosystem

07/20/2026 | TPCA
Driven by growing demand for high-value applications such as AI servers, high-speed networking, and satellite communications, Thailand, Vietnam, and Malaysia are rapidly evolving from traditional consumer electronics manufacturing bases into a complementary regional ecosystem supporting the development of advanced printed circuit boards (PCBs) and IC substrates.

Imec, Diraq Demonstrate First Coherent Operation of 8 Silicon Spin Qubits

07/16/2026 | Imec
Imec, a world-leading research and innovation hub for advanced semiconductor technologies, and Diraq, a pioneer of silicon-based quantum computing, announce they have demonstrated the coherent operation and readout of an eight silicon MOS spin-qubit array designed and fabricated on imec's advanced 300mm spin-qubit technology platform using a CMOS-compatible process.

Infineon, LS ELECTRIC Team Up on DC Power Solutions for AI Data Centers

07/16/2026 | Infineon
Infineon Technologies AG and LS ELECTRIC have signed a Memorandum of Understanding (MoU) to collaborate on high-efficiency direct current (DC) power infrastructure solutions for AI data centers and next-generation power grids.
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