American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
Peters Spotlights Heatsink Paste at productronica
October 22, 2025 | PetersEstimated reading time: 1 minute
The ELPEPCB HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025, the coatings manufacturer from Germany’s Lower-Rhine Area will be presenting the system’s high thermal conductivity of 3 W/mK to an international audience of experts.
At booth B3-343 of the exhibition center located in Munich-Riem, Peters will recommend ELPEPCB HSP 801 S with outstanding features as the latest in heatsink pastes for the thermal-management of printed circuit boards and flat assemblies.
Great layout flexibility
The single-component epoxy-based heatsink paste for screen and stencil printing offers industrial users extensive layout flexibility. Besides its thermal conductivity and high glass transition temperature (Tg beyond 150° C), the heatsink paste distinguishes itself by a low thermal expansion coefficient and impressive dielectric strength (DC). The S in the brand ELPEPCB HSP 801 S stands for low surface roughness, which enables optimal thermal coupling in combination with high thermal conductivity.
Further details on the performance of Peters heatsink paste will be explained by Sven Kramer in his presentation on the first day of the trade fair, 18 November, from 2 to 2.30 p.m. in Hall B3, not far from the Peters booth. This presentation held at the PCB & EMS Forum by the Global Manager of Application Technology is entitled ”The Next Level – Successful Thermal Management with a New Generation of Printable Heatsinks.“
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
GEN3 Systems to Showcase Advanced Reliability Test Solutions at productronica 2025 in Munich
10/29/2025 | Gen3 SystemsGEN3 a leader in innovative reliability test solutions, is excited to announce its participation at productronica 2025, the world’s premier trade fair for electronics development and production.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
10/28/2025 | John Watson -- Column: Elementary, Mr. WatsonIf electricity were a group of college students, then power electronics and the PCB designers who dive into it would insist on driving the car on every road trip because they know the car inside and out—they’re the students with jumper cables in the trunk, a tire pressure gauge in the glove box, and snacks stashed under the seat. While the others argue over playlists and directions, power electronics is busy ensuring the alternator doesn’t fry, the headlights don’t dim, and everyone reaches the destination with fuel still in the tank.
Small Material, Big Impact: IDTechEx Explores Graphene in Electronic Applications
10/27/2025 | IDTechExGraphene was initially celebrated as a sci-fi material destined to transform electronics, quantum devices, and futuristic sensors. While expectations soared, commercial reality proved more modest.
Indium Expert to Present on Advancing Thermal Performance at TestConX China
10/21/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).