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Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
October 14, 2025 | Koh YoungEstimated reading time: 1 minute

Koh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.
Héctor Hernández, Regional Sales Manager for Koh Young America, will deliver a technical session titled “The Power of Data: Maximize Productivity with Smart Factory Insights.” Based in Guadalajara, Héctor oversees Koh Young’s operations across Baja, Sonora, Durango, Chihuahua, and Jalisco. With more than a decade of experience helping electronics manufacturers enhance process capability and product quality, he brings a practical understanding of how inspection data and analytics can transform production efficiency.
His presentation explores how manufacturers can harness data to improve productivity, traceability, and quality across the SMT line. The session outlines a stepwise approach to turning raw inspection data into actionable insight. Starting with accurate 3D measurement and inspection results, Héctor will explain how to extract and interpret key metrics such as First Pass Yield (FPY), Defects Per Million Opportunities (DPMO), and Process Capability Index (CPK). He will then demonstrate how AI-driven platforms like KSMART and KPO (Koh Young Process Optimizer) use these metrics to automate programming, perform design of experiments (DOE), and optimize both printing and placement processes.
“When data is captured correctly and used intelligently, it becomes a powerful tool for driving improvement,” said Héctor Hernández. “By connecting inspection and process optimization, manufacturers can reduce variation, improve yields, and make better decisions in real time. That’s what smart factory transformation is really about.”
The presentation will also highlight how Smart Review, Koh Young’s AI-powered analysis tool, minimizes false calls and improves defect classification by learning from historical data and user judgments. Attendees will leave the session with clear strategies to:
- Enable closed-loop optimization across printing, placement, and inspection
- Implement AI-assisted decision-making to reduce human error
- Establish connectivity through IPC-CFX and SECS/GEM standards
- Drive continuous improvement in real time across SMT operations
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
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10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Arc-Tronics Strengthens Inspection Capabilities with Three New Saki AOI Systems
09/26/2025 | Saki America,Saki America, Inc., an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce that Arc-Tronics, Inc., a high-reliability EMS provider based in Elk Grove Village, Illinois, has recently installed three 3Di-LS3 Series Automated Optical Inspection (AOI) systems in its production facility.
Discover TRI's AI Ecosystem at productronica 2025
09/25/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is excited to announce its participation at productronica 2025, which will be held at Messe München Center from November 18 to 21, 2025.