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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Amkor Technology Expands Arizona Investment to $12 Billion

09/10/2026 | Amkor Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, today announced phase 2 of its Arizona Advanced packaging and test campus.

AI Drives High-End IC Substrate Growth to US$19.51B in 2026

09/10/2026 | TPCA
As demand for generative AI, high-performance computing (HPC), and data center infrastructure continues to accelerate, the global IC substrate industry is entering a new phase characterized by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.

IMAPS Symposium 2026: The Premier Event for Microelectronics Advanced Packaging

09/04/2026 | IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS) will host the 59th International Symposium on Microelectronics (IMAPS Symposium 2026) from September 28 to October 1, 2026, at the Encore Boston Harbor in Everett, Massachusetts.

Kulicke & Soffa Advances AI Infrastructure with CPO, Advanced Packaging

09/01/2026 | PRNewswire
Kulicke and Soffa Industries, Inc., a global leader in semiconductor and electronics assembly solutions, continues to strengthen its position as a critical enabler of next-generation artificial intelligence (AI) infrastructure through its advanced packaging portfolio, including Thermo-Compression Bonding (TCB) solutions which directly address emerging Co-Packaged Optics (CPO) applications.
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