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New Podcast Episode: How Does UHDI Benefit SWaP?
October 3, 2025 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 has just released the latest episode in its groundbreaking podcast series on one of the most important innovations shaping the future of electronics manufacturing: ultra high density interconnect (UHDI).
In Episode 4, SWaP Considerations, host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
“John paints a clear picture for listeners of how the industry can leverage these innovations to push the boundaries of performance and design,” says host Nolan Johnson of the 12-part series.
Across the series, listeners step inside the evolving world of UHDI with insider perspectives, practical examples, and clear takeaways that show how this technology is reshaping electronics. Each episode is paired with downloadable resources that make applying the lessons directly to professional development and day-to-day challenges easy.
I-Connect007's On the Line with...American Standard Circuits: UHDI podcast series is available now on the I-Connect007 platform and all major podcast directories.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
New Fil Arzola Class: Designing for the Future, and for Sustainability
10/07/2025 | Andy Shaughnessy, I-Connect007If you have not yet taken a class from Fil Arzola, you are missing out. In late October, Fil will be teaching the class "Building Sustainable Model-Based PCBs," speaking from the design perspective. I had the pleasure of catching this course at last year's IPC APEX EXPO, and I walked away with a lot to think about. I asked Fil to discuss his upcoming course. Registration is open now.
American Standard Circuits to Exhibit at SMTA International
10/06/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA International 2025 to be held at the Donald E Stephens Convention Center in Rosemont, Illinois on October 19th through the 23rd, 2025.
It’s Only Common Sense: Stop Whining About the Market—Outwork It
10/06/2025 | Dan Beaulieu -- Column: It's Only Common SenseWhenever the market hiccups or the industry cycle dips, I hear the same tired chorus: “The market is down. Customers aren’t buying. What can we do? We just have to wait it out.” Nonsense. If you think that by showing up, opening your doors, and waiting for the economy to smile kindly upon you, that success will follow, you are in the wrong business. Worse yet, you’re living in the wrong mindset. Most people don’t want to hear the truth that winners find business in down cycles. Losers blame the economy.
Intel Shares Surge Following Report of Early Talks to Make Chips for Rival AMD
10/03/2025 | I-Connect007 Editorial TeamIntel shares jumped on October 1, following reports that the company is in early talks to manufacture chips for rival AMD through its foundry business, according to CNBC.