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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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SMTA Elects New Board Members

08/19/2026 | SMTA
The SMTA is pleased to announce its election results for the Global Board of Directors for the term beginning October 29, 2026. Greg Vance, Rockwell Automation, has been re-elected president.

NHanced Semiconductors, UF to Present Advanced Photonics Packaging at SMTAI 2026

08/18/2026 | PRNewswire
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

Viscom to Showcase the Next Generation of AI-Powered Inspection at SMTA International 2026

08/14/2026 | Viscom Inc.
At SMTA International 2026, Viscom Inc. will present how artificial intelligence is changing the way electronics manufacturers approach automated quality inspection – from intelligent programming to increasingly autonomous inspection processes. 

Koh Young Brings Smart AI Solutions to Consecutive SMTA Regional Events Across North America

07/28/2026 | Koh Young
Koh Young Technology, the global leader in True3D measurement-based inspection and smart AI solutions, will strengthen its engagement with electronics manufacturers across North America through consecutive appearances at two SMTA regional events this August.

SMTA Announces Expansion of Advanced Electronics Assembly Conference into Asia

07/17/2026 | SMTA
The SMTA announced the Advanced Electronics Assembly Conference (AEAC) is expanding to Asia through a new partnership with the Thailand Printed Circuit Association (THPCA.)
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