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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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STARTEAM's PCB Carbon Footprint Calculator Achieves ISO 14067 Certification

06/26/2026 | STARTEAM GLOBAL
STARTEAM is proud to announce that its PCB Carbon Footprint Calculator has successfully achieved ISO 14067 certification following a successful audit by BSI.

UL Solutions Opens Advanced Automotive Electromagnetic Compatibility Laboratory in Japan

06/25/2026 | BUSINESS WIRE
UL Solutions Inc., a global leader in applied safety science, announced the opening of a new automotive electromagnetic compatibility laboratory in Toyota City, Japan, expanding its ability to support increasingly complex vehicle technologies in one of the world’s largest automotive markets.

Federal Electronics Adds Extended-Range Thermal Test Chamber

06/25/2026 | Federal Electronics
Federal Electronics, a leader in providing advanced electronic manufacturing services, announced the addition of a new in-house environmental test chamber designed to support the reliability, qualification, and validation requirements of high-performance electronic products.

Qblox Collaborates with HPE to Advance Hybrid Classical-Quantum Computing

06/25/2026 | PRNewswire
Qblox, a leading provider of scalable quantum control electronics, announced a collaboration with HPE to advance hybrid classical-quantum computing.

Quantum Machines Makes Second European Acquisition in Six Weeks with Addition of PCB Design Ltd.

06/25/2026 | Quantum Machines
Quantum Machines (QM), whose control systems are used by more than half of the world’s quantum computing companies, today announces the acquisition of Hungarian company PCB Engineering/PCB Design – its second European acquisition in six weeks.
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