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IBM Debuts World’s First Sub-1 Nanometer Chip Technology

06/29/2026 | IBM
IBM unveiled a major semiconductor breakthrough with the introduction of the world’s first sub-1 nanometer (nm) chip technology, featuring a revolutionary transistor architecture at the 0.7 nm, or 7 angstrom node.

Teledyne MEMS Selected to Support Two FABrIC Challenge Award Recipients

06/29/2026 | BUSINESS WIRE
Teledyne MEMS announced that it has been selected as the advanced micro-electro-mechanical systems (MEMS) manufacturing partner for two recipients of the latest FABrIC Challenge funding awards announced by CMC Microsystems through the Government of Canada’s FABrIC initiative.

Incap Slovakia Invests in Cleanroom Capability for Semiconductor Manufacturing

06/26/2026 | Incap
Incap Electronics Slovakia has invested in cleanroom production capability at its Námestovo facility to support growing customer demand for contamination-controlled assembly, particularly in semiconductor-related applications.

Teledyne MEMS Expands Edmonton Operations with Support from Government of Alberta

06/25/2026 | BUSINESS WIRE
Teledyne MEMS is expanding its manufacturing operations in Edmonton with support from the Government of Alberta, reinforcing the province’s growing role in the global semiconductor supply chain and creating new, high-skill jobs.

European Commission Approves €76 Million German State Aid for First-of-a-kind Semiconductor Testing Equipment Facility

06/25/2026 | European Commission
The European Commission has approved, under EU State aid rules, a €76 million German measure to support QuantumDiamonds GmbH to set up a new facility for the production of semiconductor testing equipment in Munich.
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