Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Teledyne MEMS Selected to Support Two FABrIC Challenge Award Recipients

06/29/2026 | BUSINESS WIRE
Teledyne MEMS announced that it has been selected as the advanced micro-electro-mechanical systems (MEMS) manufacturing partner for two recipients of the latest FABrIC Challenge funding awards announced by CMC Microsystems through the Government of Canada’s FABrIC initiative.

Schweizer Electronic, Ascent Circuits Plan Strategic Indo-German PCB Cooperation

06/26/2026 | Schweizer Electronic AG
Schweizer Electronic AG and ILJIN Electronics (India) Pvt. Limited, part of the Amber Group, intend to enter into a strategic cooperation in the field of printed circuit boards.

UL Solutions Opens Advanced Automotive Electromagnetic Compatibility Laboratory in Japan

06/25/2026 | BUSINESS WIRE
UL Solutions Inc., a global leader in applied safety science, announced the opening of a new automotive electromagnetic compatibility laboratory in Toyota City, Japan, expanding its ability to support increasingly complex vehicle technologies in one of the world’s largest automotive markets.

Ouster, Benchmark Expand Partnership to Scale REV8 Lidar Production

06/18/2026 | Benchmark
Ouster, Inc., a leader in sensing and perception for Physical AI, and Benchmark Electronics, Inc., a global provider of manufacturing, engineering, and technology services, announced the expansion of their long-term manufacturing partnership to support the high-volume production of Ouster's new Rev8 OS sensor family for industrial, robotics, automotive, and smart infrastructure applications.

TTM Achieves AEC-Q200 Qualification for Mini-Xinger® RF Product Portfolio

06/17/2026 | Globe Newswire
TTM Technologies, Inc. announced that its Mini-Xinger® product portfolio has achieved AEC-Q200 qualification accreditation, a significant milestone validating the product line’s conformance to the highest standards of passive component reliability for automotive and high-reliability applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in