The Signal Integrity Issue: Design007 Magazine September 2025

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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/19/2026 | Michelle Te, I-Connect007
Why do so many students who begin college intending to pursue STEM careers ultimately change direction? According to research highlighted by Malcolm Gladwell, the answer often has less to do with ability than perseverance. That spirit of continuous learning is reflected in my must-reads for the week, from major industry investments and policy developments to conferences, publications, and tools designed to help engineers improve their craft. Be sure to read the June issues of I-Connect007 Magazine and the Advanced Electronics Packaging Digest, which both published this week. They serve as a reminder that innovation depends not only on technology, but also on the people willing to keep learning and growing throughout their careers.

The PCB Designer's Blind Spot: No Feedback, No Progress

06/18/2026 | Stephan Schmidt, Pentalogix
In PCB design, time and effort are everything. You've spent weeks perfecting your schematic, routing traces, and ensuring signal integrity. Finally, you generate those Gerber files and send them off to your preferred PCB fabricator. It's a moment of relief: The design is out of your hands, and production can begin. But what happens next? For many PCB designers, the answer is surprisingly unclear. Fabricators often make manufacturability adjustments without providing detailed feedback, leaving designers unaware of recurring issues.

Elementary, Mr. Watson: PCB Education in the Midst of the Storms

06/17/2026 | John Watson -- Column: Elementary, Mr. Watson
I should probably begin with an apology, because this may be a tough pill to swallow and not the small vitamin kind. This is one of those honking, huge pills that could choke a mule. My goal is not to criticize students, dismiss academia, or blame industry. In many ways, I am part of all three conversations. I teach students trying to find their way. I work in academia and believe deeply in the value of education. I also come from an industry that needs skilled PCB designers more than ever, yet sometimes seems surprised when they do not simply appear out of the mist, holding a completed layout, a clean DRC report, and 10 years of experience.

Connect the Dots: What Designers Should Know About Non-conductive Via Fill

05/28/2026 | Matt Stevenson -- Column: Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly called upon to produce ultra high density interconnect (UHDI) PCBs, so it’s important to tune our production capabilities and customer service models to this trend. Non-conductive via fill (NCVF) offers a cost-effective, reliable manufacturing method that accommodates the densely packed, fine-pitch ball grid array (BGA) components present in UHDI designs.

New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability

05/18/2026 | I-Connect007
I-Connect007 proudly announces the recent release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new volume offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.