It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
September 8, 2025 | ASMPTEstimated reading time: 1 minute
ASMPT, the world's leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced the appointment of Mr. Gordon Lam as Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions).
Gordon joined ASMPT in August with over 25 years of key leadership experience in various global technology and enterprise solutions organizations. As Chief Commercial Officer for SEMI Solutions, he is responsible for driving the commercial strategy for its strong semiconductor assembly and packaging solutions portfolio to accelerate growth across key market segments, while adding value to and strengthening customer relationships.
Most recently, Gordon served as Chief Revenue Officer, President, and Operating Committee Member at Syniti, where he led global go-to-market strategies and drove significant business transformation. He previously held senior leadership roles at NetApp, SAP, Computer Sciences Corporation, and Microsoft, bringing extensive experience across hardware, software, and enterprise solutions. With deep expertise in sales management, strategic planning, and operations, Gordon has a proven track record of delivering multi-year growth and profitability in highly competitive markets.
"Gordon's extensive commercial leadership experience and proven ability to drive growth in complex technology markets make him an ideal fit for ASMPT as we continue to capitalize on the strong demand dynamics in advanced packaging and AI-driven semiconductor applications,” said Robin Ng, Chief Executive Officer of ASMPT. “His appointment reinforces our commitment to strengthening our commercial capabilities and deepening our customer partnerships globally."
"I'm thrilled to join ASMPT as Chief Commercial Officer at a pivotal moment for our industry. Our comprehensive semiconductor assembly and packaging solutions are an exceptional platform for customer success,” explained Gordon. “With strong market demand for advanced semiconductor technologies, I am focused on strengthening customer partnerships and accelerating our commercial strategy, focusing on next-generation packaging and processing applications."
Gordon holds a dual degree in Electrical Engineering and Computer Science from UNSW and completed the Senior Executive Leadership Program at Stanford University. He is also a contributing member of the Forbes Technology Council.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
10/14/2025 | I-Connect007 Editorial TeamThe Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing
10/10/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Erich Thallner, President and Co-founder of EV Group (EVG), as its first SEMI Americas Catalyst Award recipient at SEMICON West 2025.