-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
September 5, 2025 | Akrometrix LLCEstimated reading time: Less than a minute
Akrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system. This system greatly improves temperature uniformity and heating rates, allowing for industry leading emulation of reflow conditions.
Featuring a multi-zone bottom heater and independently controlled topside heaters, the PS600T allows uniform heating and cooling, covering temperature ranges from room temperature to 300°C. The large format tool and heating system are designed around samples up to 600x600mm in size. The new tool offers new levels of automation in lensing, temperature response, and a new touch screen HMI, with foreign language support.
The PS600T is expandable to include Akrometrix modules for Digital Fringe Projection technology, to complement shadow moiré and cover different sample application needs, as well as Digital Image Correlation to measure surface strain and calculate composite CTE of materials.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCB