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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

New, Greener Solutions for Etch: Novel Copper Extraction

03/30/2026 | Richard Nichols, GreenSource Engineering
“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.

Indium, Rio Tinto Announce Groundbreaking Milestone in Gallium Extraction Partnership

05/07/2025 | Indium Corporation
Indium Corporation and Rio Tinto announced the successful extraction of gallium from feed sourced at Rio Tinto’s Vaudreuil alumina refinery in Saguenay, Quebec, Canada. This achievement highlights the power of collaboration in building a more robust global supply chain for gallium.

Siemens Collaborates with Samsung Foundry to Expand 3D-IC Enablement Tools

06/14/2024 | Siemens
Siemens Digital Industries Software today announced that, in collaboration with Samsung Foundry, they have developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading IC design and verification technologies.

CE3S Announces Webinar: Workplace Health & Safety with PACE Fume Extraction Systems

02/26/2024 | CE3S
Cumberland Electronics Strategic Supply Solutions (CE3S), a leading provider of quality goods and services, is excited to announce an upcoming webinar titled "Workplace Health & Safety with PACE & CE3S: Fume Extraction and the Benefits to your Workforce." The webinar will take place on Thursday, March 28, from 1-2 p.m. EDT.

Dana on Data: Nuke the Netlist

01/18/2024 | Dana Korf -- Column: Dana on Data
Late last year, I started thinking about the IPC-D-356 netlist. Why do we generate it? What is its purpose? Why are there so many issues using it? The central theme of my I-Connect007 columns, as well as presentations at PCB technical meetings, has focused on improving data package quality sent from designers to manufacturers. The goal is to transfer the design information to manufacturing and build the PCBs as-is. No semi-automated DFM, stackup generation, CAM editing, or data quality analysis should be needed.
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