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Advanced Electronics Packaging Digest

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STARTEAM GLOBAL Joins IPAI to Advance AI Innovation in PCB Manufacturing

09/16/2026 | STARTEAM GLOBAL
We are pleased to announce that STARTEAM GLOBAL has joined IPAI (Innovation Park Artificial Intelligence), one of Europe’s leading AI innovation hubs dedicated to accelerating the practical application of AI across industries.

It’s Only Common Sense: Why Should They Take Your Call?

09/14/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Think about the customer receiving your sales call. She’s dealing with material shortages, changing laminate allocations, extended component lead times, tariff questions, unpredictable transportation costs, and management pressure to protect both delivery and margin. Then the phone rings, and a salesperson asks, “Do you have anything I can quote?” It’s time to rethink that relationship. Call customers because you have information that could help them make a better decision, not because you want an order. Instead of asking, “What can you give me?” you are saying, “Here is something you should know.” Now you are a resource, not an interruption.

Koh Young America’s Ray Welch Marks 100th Advanced Solder Paste Inspection and Print Process Training Class

09/10/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, is celebrating an important customer training milestone as Ray Welch, Sr. Applications Engineer at Koh Young America, recently delivered his 100th SPI Level 2 Print Process training class.

Zuken Launches E3.series 2027 With Expanded Engineering and Manufacturing Capabilities

09/08/2026 | Zuken
Zuken announced E3.series 2027, the latest release of its electrical design software for wiring, wire harness, fluid, and control systems design.

IPC-1751 Builds Supply Chain Infrastructure for the Future

09/01/2026 | Nolan Johnson, I-Connect007
IPC-1751 Committee Chairs Nikki Johnson, VP of operations and regulatory at Source Intelligence, with over 20 years of experience in compliance standards, and Dr. N Nagaraj, a chemical engineer and former NASA contractor who helped develop early IPC compliance solutions, discuss IPC-1751, the newly adopted JSON-based standard that replaces the older XML format. In this roundtable-format conversation, Johnson and Nagaraj explain how IPC-1751 serves as a modular "envelope" that connects related standards (IPC 1752–1757, IPC-1782) for material composition, lab reports, and conflict minerals.
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