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Klaus Koziol - atg

Suggested Items

New Podcast Episode Drop: Understanding How Chemistry and Drilling Collaborate for OTI

08/07/2025 | I-Connect007
MKS’ Atotech’s Frank Bruening (GM) and Roger Massey (Senior Manager, Strategic Planning) join On the Line With… host Nolan Johnson to unpack the growing complexities of achieving optimal interconnect and the critical role chemistry plays. Their discussion highlights the interplay between laser drilling, substrate layer chemistry, and plating processes, offering valuable insights for engineers.

MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025

08/06/2025 | MKS Instruments, Inc.
MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.

Advancing Electrolytic Copper Plating for AI-driven Package Substrates

08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ Atotech
The rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.

New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI

07/28/2025 | I-Connect007
The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.

New Podcast Series Launches: Optimize the Interconnect

07/16/2025 | I-Connect007
I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of business development at MKS’ ESI. This insightful series explores how MKS’ ESI is rethinking microvia formation for today’s most advanced HDI PCB and substrate designs.
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