NCAB Breaks Down Updated Tariff Rate Change
August 4, 2025 | NCAB GroupEstimated reading time: Less than a minute
These are the new tariff rates that will go into effect Aug. 7, 2025 at 12:01am EST. Any shipments entering U.S. customs after this time will be affected.
These are the official rates verified as of 11:48am EST Aug. 1. As new applicable information becomes available, NCAB will communicate it transparently and in a timely manner.
Tariff Breakdown:
- Thailand: 19% (Previous rate: 10%)
- South Korea: 15% (Previous rate: 10%)
- Taiwan: 20% (Previous rate: 10%)
Reminder: Current Rate for China source of origin
- All PCB technologies (except 2 & 4 layer): 55% total, with 25% from Section 301 tariffs, 20% from Fentanyl Crisis tariffs, and 10% from Reciprocal tariffs. The “Reciprocol” tariffs are set to expire on Aug. 12.
- 2 & 4 layer PCBs: 30% total (Exempt from Section 301 tariff until Aug. 31, 2025.
If you have questions on the tariff timeline or to explore alternative sourcing options, contact Jeffrey Beauchamp at ncabgroup.com.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
New Podcast Episode Drop: Understanding How Chemistry and Drilling Collaborate for OTI
08/07/2025 | I-Connect007MKS’ Atotech’s Frank Bruening (GM) and Roger Massey (Senior Manager, Strategic Planning) join On the Line With… host Nolan Johnson to unpack the growing complexities of achieving optimal interconnect and the critical role chemistry plays. Their discussion highlights the interplay between laser drilling, substrate layer chemistry, and plating processes, offering valuable insights for engineers.
ASMPT Introduces MEGA Multi-chip Bonding Platform
08/06/2025 | ASMPTASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new MEGA multi-chip bonding platform.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services
07/31/2025 | Global Electronics AssociationThe Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO).
Hon Hai Technology Group (Foxconn) and TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/31/2025 | Hon Hai Technology GroupHon Hai Technology Group (“Foxconn”) and TECO Electric & Machinery Co Ltd (“TECO”) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.