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Advanced Electronics Packaging Digest

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From Legacy to Next-Generation PCBAs: Zero-Defect Testing in Aerospace and Defense Electronics

10/13/2026 | Francesca Pinto, SPEA
In the aerospace and defense industry, a PCB assembly is never just a collection of components soldered onto a substrate. It is a working part of a much larger mission system responsible for flight control, navigation, communication, power distribution, surveillance, or targeting. Whether it sits inside a civil aircraft, an autonomous drone, a compact satellite, an advanced radar unit, or a military ground vehicle, that assembly is expected to perform without fail throughout its service life, often measured in decades.

Honeywell Aerospace, Aeronamic Open Netherlands F-35 Test Cell

10/12/2026 | Honeywell
Honeywell Aerospace in collaboration with Aeronamic, an aircraft components and services provider based in the Netherlands, has announced the commencement of a Modular Test Cell at the Royal Netherlands Air & Space Force (RNLASF), Woensdrecht Air Support Command.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.

Trio-Tech Secures $4.45M Burn-In Equipment Contract

10/08/2026 | BUSINESS WIRE
Trio-Tech International, a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has secured a new three-year contract valued at approximately $4.45 million to provide burn-in testing equipment and ongoing technical and maintenance support to an existing European automotive semiconductor customer.

Teradyne Introduces Titan HP Platform for AI Data Center Devices

10/06/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced a production-ready system that delivers enhanced burn-in capabilities on its Titan™ HP platform.
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