Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
July 18, 2025 | Tata ElectronicsEstimated reading time: 1 minute
Tata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries. The MoU was signed by Dr Randhir Thakur, CEO & MD, Tata Electronics, and Dirk Kress, Executive Vice President Semiconductor Operations, Robert Bosch GmbH.
Tata Electronics and Bosch intend to collaborate on chip packaging and manufacturing at Tata Electronics’ upcoming assembly and test unit in Assam and foundry in Gujarat. A secondary exploration field is identifying and pursuing local projects within Electronic Manufacturing Services (EMS) for vehicle electronics with mutual benefit to both companies.
Dr. Randhir Thakur, CEO and MD of Tata Electronics, said, “We are excited to partner with Bosch to help Bosch create a robust and reliable supply chain for key technology products. This partnership is well-aligned with our commitment to help create a holistic semiconductor and electronics ecosystem in India, with offerings that resonate with customers around the world. Most importantly, our collaboration is yet another significant step towards creating a leadership position for the Indian electronics manufacturing sector on the global stage.”
Dirk Kress, Executive Vice President Semiconductor Operations, Robert Bosch GmbH, said: “Bosch recognises the increasing demand for advanced automotive electronics and their critical role in shaping the future of mobility. To address the growing needs and foster supply chain resilience, Bosch is pleased to foster partnership with Tata Electronics, a key player and innovation leader in the Indian market. This move signifies Bosch's and Tata Electronics’ commitment to local collaboration and acknowledges the strategic importance of the burgeoning automotive sector in India.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SMT007 Magazine November 2025: Inside Mexico’s Rise as an Electronics Manufacturing Leader
11/03/2025 | I-Connect007 Editorial TeamMexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. In this issue, we uncover why Mexico is earning global recognition. From top-ranked manufacturing capabilities to expanding partnerships that reach far beyond the U.S.
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.