Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

SEMI Reports Worldwide Silicon Wafer Shipments Increase 3% YoY in Q3 2025

11/04/2025 | SEMI
The SEMI Silicon Manufacturers Group (SMG) reported today, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year to 3,313 million square inches (MSI) from the 3,214 MSI recorded during the same quarter of 2024.

SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028

10/30/2025 | SEMI
Global shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reported in its annual silicon shipment forecast. ​​​​​​

SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028

10/29/2025 | SEMI
Global shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reported today in its annual silicon shipment forecast.

Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors

10/14/2025 | openPR
The semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).

Too Important to Ignore: Unpacking Advanced Packaging for AI Semiconductor – Report Summary

09/16/2025 | Futurum
Advanced packaging is becoming the cornerstone of AI semiconductor scaling, with 2.5D/3D integration, CoWoS, CPO, CoPoS, and SoW-X set to drive major gains in performance, bandwidth, and efficiency through the 2020s.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in