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Advancing the Advanced Materials Discussion
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Webinar: INEMI Printed Circuit Board Roadmap
June 13, 2025 | iNEMIEstimated reading time: 2 minutes
Join INEMI PCB Roadmap Chairs Tarja Rapala and Joe Beers for a look at what lies ahead for PCB technologies. This webinar, hosted by INEMI Director of Roadmapping Francis Mullany, will:
- Review highlights of INEMI’s 10-year roadmap for PCBs, including high-speed PCBs and substrates, laminates, mmWave PCBs, test and inspection, and environmental issues.
- Highlight next steps for the INEMI PCB Roadmap and brainstorm future directions for PCB technology.
About the INEMI Roadmap
The INEMI Roadmap charts — over a 10-year horizon — the future evolution of electronics manufacturing in terms of application and market drivers, technical needs, maturity of technical solutions, expected gaps and challenges. Modern electronic systems and applications drive the iNEMI Roadmap. The various roadmap teams focus on the full product lifecycle, from component design to manufacturing to deployment to end of life, and the complete ecosystem from materials suppliers to system integrators.
About the Speakers
Tarja Rapala-Virtanen
Technical Director, EIPC
Tarja Rapala-Virtanen is a technology professional with more than 25 years of experience in managing complex electronics projects and technology, particularly in the field of printed circuit boards. Her expertise spans various aspects of PCB technology, including interconnection and circuit board technology. She has led global engineering and R&D functions both in Finland and China and is currently the Technical Director of EIPC, the European Institute for the PCB Community. Tarja holds an M.Sc. degree in chemical engineering from Abo Akademi in Turku, Finland.
Joe Beers
Senior Vice President
Gold Circuit Electronics Global Sales and Service
Joe Beers has more than 30 years of experience in the manufacture of printed circuit boards and varied experiences as a laboratory chemist, process and product engineer, quality director and manufacturing leader. At Gold Circuit Electronics he has held a variety of positions in the areas of engineering and quality support. He has worked closely with OEM customers, with a specific focus on materials and processes, coupled with quality management and field experience. Joe graduated with a chemistry degree from Adelphi University in New York.
Registration
This webinar is open to all in the industry; advance registration is required. You will need to log into your web account (free to members and non-members) to register. If you do not have a current web account, please create one and set up your profile. If you have any questions or need additional information, please contact Francis Mullany (fmullany@inemi.org).
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Ventec to Exhibit Latest Materials and Machinery for Cutting-edge PCB Production at productronica 2025
11/05/2025 | Ventec International GroupVentec International Group will present advanced materials at Productronica 2025 in Munich, ushering in the ‘Glass Free Revolution’ with the latest and pro-bond & thermal-bond bondply materials.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
High Density Packaging User Group Announces ASKPCB Membership
11/03/2025 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
PCBAA Names Industry Veteran Dan Weber to Board of Directors
10/31/2025 | PCBAAThe Printed Circuit Board Association of America has added Dan Weber, Executive Vice President and General Counsel at TTM Technologies, to the PCBAA board of directors.