Punching Out: M&A North American PCB and EMS Deals for the First Half of 2025
The Chemical Connection: Sales Organization from a Capital Equipment Perspective
Marcy’s Musings: From Pitch to PO—The Sales Stack
IPC Releases Latest Standards and Revisions Updates
June 5, 2025 | IPCEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2 2025.
IPC-1602A
Standard for Printed Board Handling and Storage
The industry's sole standard on the handling, packaging, and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD, and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling, and transport of product, as well as establishing baking profiles for moisture removal. This document addresses the impact of baking on printed board solderability, moisture concerns for etched cores and composites, dry packaging requirements including moisture barrier bags (MBBs), desiccant material and HIC cards, test coupons for evaluating relative moisture absorption and guidance for floor life and rework by baking.
IPC-7095E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair, and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides valuable and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions of how to successfully implement robust design and assembly processes for printed board assemblies using BGAs, as well as ways to troubleshoot some common anomalies that can occur during BGA assembly.
IPC-8401
Guidelines for In-Mold Electronics
IPC-8401 provides guidelines for in-mold electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-mold electronics integrate printed electronics and electrical components into injection-molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME parts are structural electronics characterized by their light weight, thinness, robustness, and seamless integration.
Get the rest of the updates in the Spring 2025 issue of IPC Community.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Calumet Electronics Continues to Advance Domestic HDI Circuit Board and Organic Substrate Capability
07/25/2025 | Calumet ElectronicsCalumet Electronics Corporation, a leading American-made printed circuit board (PCB) manufacturer, today announces another major milestone in its ambitious program to bring advanced high-density interconnect (HDI) and high-density buildup (HDBU) capabilities online.
LPKF Increases Revenue in the 1H of 2025 Despite global uncertainties
07/24/2025 | LPKFThe LPKF Group increased revenue by 7.2% to EUR 59.2 million in the first half of 2025 and achieved an almost balanced adjusted EBIT* (earnings before interest and taxes) of EUR -0.7 million.
Amphenol Reports Record Q2 2025 Results
07/24/2025 | Amphenol CorporationThe Company continues to deploy its financial strength in a variety of ways to increase shareholder value. During the second quarter, the Company purchased 2.0 million shares of its common stock for $160 million and paid dividends of $200 million, resulting in total capital returned to shareholders of approximately $360 million.
Ynvisible Strengthens Commercial Readiness with CCL Design
07/24/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc. is pleased to announce the successful completion of a strategic technology transfer with CCL Design, a global leader in printed electronics and specialty labeling.
Cicor Grows Double-Digit Again and Creates Strong Foundation for Further Expansion
07/23/2025 | Cicor Technologies Ltd.In the first half of 2025, Cicor Group took a significant step towards its ambition of becoming the pan-European leader in its chosen markets as announced in the strategy 2028, expanding market presence into France and Spain.