Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment

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Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility. This investment significantly enhances Microsembly’s fine-pitch interconnect and high-power bonding capabilities—supporting expanding customer demand across aerospace, defense, medical, and telecom markets.

The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond bonders, and a Besi Datacon 2200 Evo Bonder.  They’ve also added a Palomar SST 5100 Vacuum Pressure Furnace for void free eutectic die attach.

With this equipment, Microsembly delivers a full spectrum of wire bonding and die attach services for the manufacturing of RF/microwave PCBAs used in complex mixed technology RF/microwave assemblies.

Wire and Ribbon Bonding and Die Attachment capabilities enabled by these systems include:

• Gold (Au) ribbon bonds as small as .002” x .0005”
• Au wedge bonds down to .0007” on FETs, MMICs
• Au ball bonds and stitch-on-ball (SOB) bonds down to .0007”
• Quad diode package bonding with Au ribbon bonds down to .003” x .00025”
• Conductive epoxy die attach bond line thicknesses as little as .002”
• Combination bonds including ball, stitch-on-ball, and ribbon bonding
• Omega wrap (Double-C) ribbon bonds on feedthroughs
• Beam lead tacking with waffle patterning
• Cross bond stitching on ultra-small mesa diodes
• Precise MMIC-to-capacitor interconnects
• Void Free Eutectic Die Attach

“These machines not only add speed and repeatability but also allow our technicians to perform extremely precise and specialized bonds critical to high-reliability systems,” said Phuong “Kent” Dang, President at Microsembly. “From ultra-fine interconnects on microwave dies to rugged ribbon bonds on high-power components, we can handle a wide range of RF and microwave assembly challenges with confidence.”

This enhanced wire bonding and die attach suite supports Microsembly’s vertically integrated model, offering everything from initial design and prototyping to high-frequency testing and full-volume production. Customers benefit from rapid development cycles, U.S.-based manufacturing, and proven quality assurance processes built for mission-critical environments.