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E&R Engineering to Open Malaysia Plant for Packaging Materials and Local Services

10/05/2026 | PRNewswire
E&R Engineering Corp., an international provider of semiconductor packaging equipment, announced the upcoming grand opening of its new Malaysian subsidiary—E&R SEMICONDUCTOR (MALAYSIA) SDN. BHD.—at the Melaka Free Trade Zone on October 13.

EMD Electronics Opens Wisconsin R&D Facility for Semiconductor Materials

10/02/2026 | Globe Newswire
EMD Electronics, the North America electronics business of Merck KGaA, Darmstadt, Germany, announced the opening of a new 38,000-square-foot research and development facility at its Sheboygan Falls, Wisconsin site, expanding the company’s ability to develop and scale advanced materials for next-generation semiconductor manufacturing.

DENSO Manufacturing Athens Tennessee Marks Months of Solar Energy Generation

10/01/2026 | PRNewswire
DENSO, a leading mobility supplier, is announcing the establishment and months of successful operation of a new solar energy facility at DENSO Manufacturing Athens Tennessee, Inc. (DMAT).

SK hynix Indiana Groundbreaking: Bringing Next-Generation AI Memory to the U.S.

09/30/2026 | SK hynix
SK hynix's recent groundbreaking ceremony in West Lafayette, Ind., marked a major milestone in development of the U.S. semiconductor supply chain. T

Tata Electronics, Enomoto Sign MoU to Strengthen India Semiconductor Packaging

09/24/2026 | Tata Electronics
Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, and Enomoto Co., Ltd., a leading Japanese precision semiconductor component manufacturer, have signed a Memorandum of Understanding (MoU) to advance the semiconductor packaging ecosystem in India, and support Tata Electronics’ packaging facility in Jagiroad, Assam. 
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