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AT&S Opens Europe’s First IC Substrate Plant and Competence Center in Leoben

06/04/2025 | AT&S
AT&S officially inaugurated its new Competence Center for R&D and IC Substrate Production on Tuesday with a high-profile ceremony at its headquarters in Leoben-Hinterberg. Numerous high-ranking guests from politics, industry, and the media were welcomed to the event and given an exclusive tour of the 11,000-square-meter site of cutting-edge technology. With an investment of more than € 500 million,

When Small Just Isn’t Small Enough; INSPECTIS Launches Micro Size Optical Probe Tip for BGA Inspection

06/03/2025 | INSPECTIS
The Inspectis BGA inspection system now offers the tiniest optical probe, the Micro Size Optical Probe Tip, for users who feel that they need to get ‘really small’.

DRAM Revenue Drops 5.5% in the First Quarter of 2025; SK hynix Overtakes Samsung for Top Spot

06/03/2025 | TrendForce
TrendForce’s latest findings reveal that global revenue for the DRAM industry reached US$27.01 billion in 1Q25, marking a 5.5% QoQ decline. This downturn was driven by falling contract prices for conventional DRAM and a contraction in HBM shipment volumes.

Micro LED Expands Beyond Displays, Unlocking New Opportunities in Transparent and Non-Display Applications

05/30/2025 | TrendForce
TrendForce forecasts that the chip market value for Micro LED display applications will reach US$740 million by 2029, with a CAGR of 93% from 2024 to 2029.

Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment

05/30/2025 | Microsembly
Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.
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