-
-
News
News Highlights
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
NVIDIA Expected to Launch RTX PRO 6000 Special Edition for China’s AI Market, Potentially Boosting Future GDDR7 Demand
May 28, 2025 | TrendForceEstimated reading time: 1 minute
TrendForce reports that following the new U.S. export restrictions announced in April—which require additional permits for the export of NVIDIA’s H20 or any chips with equivalent memory bandwidth or interconnect performance to China—NVIDIA is expected to release a special low-power, downscaled version of the RTX PRO 6000 (formerly B40) for the Chinese market. This model will reportedly switch from the originally planned HBM memory to GDDR7, with a potential market debut as early as the second half of 2025.
TrendForce’s recent industry interviews in China indicate that after the new export rules were introduced, NVIDIA’s Chinese CSP customers have been unable to secure the H20. The previously planned B30 model, which was set to launch in the second half of this year, is now expected to face delays or changes.
TrendForce estimates that the performance of the China-specific RTX PRO 6000 will fall between that of the previous-generation L40S and the L20 China edition. Demand for the L20 remains steady among local CSPs, particularly for applications like small-scale model training or AI inference, suggesting that the RTX PRO 6000 China edition will see a similar uptake upon release. However, as the higher-end H20 and B30 models (equipped with HBM) are blocked from the Chinese market, NVIDIA is poised to face stiffer competition from domestic players like Huawei and Cambricon, who are advancing their own AI solutions.
The memory of the RTX PRO 6000 for the Chinese market will be downgraded from HBM3e to GDDR7 to comply with U.S. export restrictions. Major memory suppliers have begun ramping up GDDR7 production with NVIDIA’s recent launch of the RTX 50 series consumer GPUs. Still, since gaming consoles and other consumer applications have yet to adopt GDDR7, its main demand through the first half of 2026 is expected to come from NVIDIA-led segments—namely PC, workstation GPUs, and AI server applications.
Samsung is set to maintain its lead in GDDR7 production schedules and capacity throughout 2025, commanding a market share as high as 70%. NVIDIA remains heavily reliant on Samsung-manufactured GDDR7. TrendForce expects future GDDR7 price fluctuations to remain relatively stable, with prices either holding steady or seeing slight increases.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
10/09/2025 | SEMIGlobal 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.