Dan’s Biz Bookshelf: ‘In Defense of a Liberal Education’
American Made Advocacy: A Growing Presence in Washington in Turbulent Times
Promex Industries CEO Richard Otte Honored with IEEE Electronics Manufacturing Technology Award
May 27, 2025 | PromexEstimated reading time: 1 minute
Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced that CEO Richard (Dick) Otte has received the 2025 Electronics Manufacturing Technology Award from the IEEE Electronics Packaging Society (EPS). The annual award recognizes individuals who have made impactful, sustained contributions to the field over 15 years or more, such as leading the development of major new processes in electronic manufacturing or significantly improving the yield or reliability of established processes.
“Our selection committee was very pleased to give this year’s award to Dick Otte,” said Dr. Patrick McCluskey, EPS program director, awards program. “His contributions are widely known and admired throughout our industry. From helping drive creation and advancement of the Heterogeneous Integration Roadmap, to heightening awareness of U.S.-based packaging and assembly capabilities, Dick has been a great champion for our sector and its importance for advanced electronics.”
Otte has dedicated more than five decades to advancing electronics packaging, shaping the industry with groundbreaking innovations. One of his earliest achievements was leading the development and introduction of multichip modules (MCMs) at Advanced Packaging Systems in the ’90s, laying the foundation for increasingly sophisticated packaging techniques. Building on that success, Otte continued pioneering methods for creating smaller, denser, and more complex assemblies that integrated semiconductor die alongside non-electronic components—an approach that marked the beginning of heterogeneous integration.
His contributions included supporting industry technical roadmaps: IEEE International Technology Roadmap for Semiconductors (ITRS), IEEE Heterogeneous Integration Roadmap (HI), and the iNEMI and International Photonic System Roadmaps (IPSR). The latter anticipated the integration of optical technologies to enhance data rates while reducing power consumption. Through his innovative work, Otte has contributed to advancements that have significantly improved the functionality, efficiency, and reliability of electronic devices across the medical, biotech, communications, and data processing industries—helping shape the future of smaller, smarter, and more dependable technology.
The award will be presented during the EPS Luncheon at the Electronic Components and Technology Conference (ECTC) in Dallas, Texas, on May 29, 2025.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey
07/31/2025 |ASMPT has been recognised for excellence in the 2025 TechInsights Global Semiconductor Supplier Survey for the 12th consecutive year. This year, it was ranked third for excellence in customer service among large equipment suppliers.
Libra Industries Launches In-House High Precision Underfill Capabilities
07/17/2025 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities.
YES Delivers Multiple VertaCure LX Systems
07/08/2025 | BUSINESS WIREYield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, announced the delivery of multiple VertaCure™ LX curing systems to one of Taiwan’s top outsourced semiconductor assembly and test (OSAT) providers.
AI, HPC Fuel Advances in Packaging Technology 3DIC, FOPLP, and Chiplet Forums Gain Global Spotlight
07/03/2025 | SEMIAs demand for AI and HPC accelerates, the semiconductor industry is embracing a new era. With Moore’s Law slowing and scaling challenges rising, technologies like 3DIC, panel-level fan-out (FOPLP), chiplets, and co-packaged optics (CPO) are becoming essential for next-level performance and system integration.
Xanadu Opens $10M Advanced Photonic Packaging Facility in Ontario
06/25/2025 | PRNewswireXanadu, a world leader in photonic quantum computing, has opened a $10M world-leading advanced photonic packaging facility in Toronto. This facility represents a significant leap in Canada's quantum supply chain resilience and technical capacity.