Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
May 26, 2025 | ClassOne TechnologyEstimated reading time: Less than a minute
ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging. The two companies will leverage their respective semiconductor chemistry expertise to create innovative solvent solutions for a range of advanced semiconductor and packaging process applications.
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices. NMP, or N-Methylpyrrolidone, is a chemical compound long used in a variety of industries, including semiconductor fabrication, for removal of surface materials.
ClassOne has been a strategic supplier to IBM since 2014, developing technologies in electroplating, metal lift-off (MLO) and wet cleaning processes, and subsequently expanding to advanced packaging applications.
ClassOne CEO Byron Exarcos noted, “This collaboration represents a significant step forward in developing alternatives for advanced semiconductor processing. Combining our flexible wafer-processing platform and seasoned team with IBM’s extensive research experience and resources will result in novel solutions that we look forward to sharing throughout our industry.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
SEMI Europe, Partners Host High-Level Forum to Tackle Semiconductor Talent Gap
09/19/2025 | SEMISEMI Europe, in partnership with the European Chips Diversity Alliance (ECDA), the European Chips Skills Academy (ECSA), OECD, and EU STEM Coalition, has invited policymakers, educators, and industry leaders to join its forum on “Accelerating Europe’s Tech Advantage” in Brussels on October 2, 2025.
iDEAL Semiconductor Announces Polar Semiconductor as Manufacturing Partner for SuperQ™ Power Devices
09/18/2025 | PRNewswireiDEAL Semiconductor confirms that its ultra-efficient SuperQ™ silicon power devices are now in production at Polar Semiconductor, a leading foundry specializing in high-voltage, power, and sensor technologies.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
Zhen Ding Drives AI-Powered Digital Transformation
09/12/2025 | Zhen DingDriven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$ trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout