The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
Dan’s Biz Bookshelf: ‘Notorious: Leadership Lessons From History’s Most Notorious Leaders’ (New Audio Version)
Recognizing IPC Scholarships, Awards, and Opportunities
May 21, 2025 | Charlene Gunter du Plessis, IPC Education FoundationEstimated reading time: 1 minute
There was no better way to end our year in 2024 than by recognizing hard-working and driven students and educators for their involvement and interests in the electronics manufacturing industry. Through the IPC Scholarship and Awards program, we can help students invest in their future and reward their hardworking and dedicated accomplishments.
Scholarships are hugely important because they help students avoid and alleviate college debt and provide professional growth opportunities. In 2024, the IPC Education Foundation awarded more than $172,000 to deserving high school students, college/university students, student leaders, and educators.
2024 IPC Student Member Scholarship Winners
The IPC Education Foundation awarded 45 IPC Student Members with an IPC Student Member Scholarship at $1,000 each. The scholarship recipients are members at the following IPC Student Chapters: 36 from Auburn University; two from Purdue University; and one each from Binghamton University, California Polytechnic State University, Central Carolina Community College, Michigan Tech University, University of California-Irvine, University of Maryland, College Park, and University of Utah.
Click here to read the list of recipients.
This article originally appeared in the Spring 2025 issue of IPC Community.
Read more articles in the Spring issue:
- Life in the Fast Lane: Bill Cardoso is transforming roadsters into electric cars
- Future-proofing Electronics: Safer chemistries, more sustainability. Rachel Simon of ChemFORWARD details a new initiative
- Leadership That Inspires Change: Find out how Barry Matties used passion, creativity, and continuous improvement strategies to build I-Connect007 into the leading news organization for the electronics industry
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.
Building Industry-ready Talent Through Standards-based Education
04/27/2026 | Global Electronics AssociationRecently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification.
Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
04/27/2026 | Nolan Johnson, I-Connect007This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.