-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging
May 15, 2025 | BUSINESS WIREEstimated reading time: 2 minutes
ITEN, a global leader in micro solid-state batteries, and A*STAR Institute of Microelectronics (A*STAR IME), a leader in advanced packaging research, have announced a groundbreaking achievement for the integration of ITEN’s micro batteries using A*STAR IME’s cutting-edge advanced packaging platform. This milestone paves the way for in-package energy storage solutions, enabling more efficient, compact, and reliable system-in-package (SiP) designs.
Revolutionizing Energy Storage and Advanced Packaging
This breakthrough innovation represents a significant leap forward in SiP technology. By embedding ITEN’s high-performance solid-state batteries at the wafer level, ITEN and A*STAR IME have successfully demonstrated integrating non-volatile energy storage directly using advanced packaging. This enables seamless integration, elevating energy efficiency and operational reliability of electronic components.
Key Benefits and Applications
Enhanced Efficiency: Seamless integration maximizes energy transfer while minimizing power loss, resulting in improved overall performance.
Compact Design: Embedding micro batteries within the packaging significantly reduces the device footprint, ideal for next-generation portable and wearable devices.
Increased Reliability: The integration in a single package not only reduces assembly complexity but also improves interconnect reliability. With fewer solder joints and connectors, the potential points of failure decline, which can lead to higher reliability.
A Step Towards a Sustainable Future
The collaboration underscores a shared commitment to environmental sustainability. ITEN’s batteries are free from hazardous materials, providing a safer, eco-friendly alternative. By enabling longer device life and reducing the need for external power components, this innovation contributes to minimizing electronic waste.
Industry Collaboration and Future Prospects
This achievement marks the beginning of a new era in packaging innovation, especially for 3D chip integration architectures with built-in energy sources. ITEN and A*STAR IME are actively exploring future applications in consumer electronics, medical devices, and IoT solutions, where compactness and energy efficiency are critical.
“We are pleased to collaborate with ITEN to develop breakthrough advanced packaging technologies that meet the needs of the growing microelectronics market. Such efforts will enable new applications of SiP, creating new market opportunities,” said Terence Gan, Executive Director of A*STAR IME.
Vincent Cobee, CEO of ITEN, added, “A*STAR IME’s strong knowledge and expertise in advanced packaging technologies support us in accelerating the development of new micro batteries optimized for integration into SiP. This is a major step forward in addressing the challenges of energy efficiency across a wide spectrum of applications.”
Leader in Advanced Packaging Research
A*STAR IME’s research is centered around three architecture families: high density fan-out wafer-level packaging (HD FOWLP), 2.5D interposer and 3D interposer, from which eight platforms are derived: mold-first FOWLP, redistribution layer (RDL)-first FOWLP, passive interposer, active interposer, photonic interposer, wafer-to-wafer (W2W) hybrid bond, chip-to-wafer (C2W) hybrid bond, and C2W micro-bump. A*STAR IME also develops manufacturing techniques, packaging architectures, electrical-thermal-mechanical (ETM) models, and package process design kits (PDK) advancing the industry’s packaging roadmap.
Suggested Items
ASMPT Presents Die Bonder with Intelligent Features
05/14/2025 | ASMPTASMPT, the leading supplier of production equipment for advanced packaging and semiconductor assembly, introduces its flagship INFINITE bonder, which achieves top performance in throughput and quality.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.
BEST Inc. Offers Complete Portfolio of Electronic Component Salvaging Services
05/12/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they offer a complete range of electronic component salvaging services. With more than 20 years of BGA salvaging experience, BEST has the knowledge, skills, and proper equipment to reliably remove and prepare components for later use in the assembly of printed circuit boards.
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.