The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging
May 15, 2025 | BUSINESS WIREEstimated reading time: 2 minutes
ITEN, a global leader in micro solid-state batteries, and A*STAR Institute of Microelectronics (A*STAR IME), a leader in advanced packaging research, have announced a groundbreaking achievement for the integration of ITEN’s micro batteries using A*STAR IME’s cutting-edge advanced packaging platform. This milestone paves the way for in-package energy storage solutions, enabling more efficient, compact, and reliable system-in-package (SiP) designs.
Revolutionizing Energy Storage and Advanced Packaging
This breakthrough innovation represents a significant leap forward in SiP technology. By embedding ITEN’s high-performance solid-state batteries at the wafer level, ITEN and A*STAR IME have successfully demonstrated integrating non-volatile energy storage directly using advanced packaging. This enables seamless integration, elevating energy efficiency and operational reliability of electronic components.
Key Benefits and Applications
Enhanced Efficiency: Seamless integration maximizes energy transfer while minimizing power loss, resulting in improved overall performance.
Compact Design: Embedding micro batteries within the packaging significantly reduces the device footprint, ideal for next-generation portable and wearable devices.
Increased Reliability: The integration in a single package not only reduces assembly complexity but also improves interconnect reliability. With fewer solder joints and connectors, the potential points of failure decline, which can lead to higher reliability.
A Step Towards a Sustainable Future
The collaboration underscores a shared commitment to environmental sustainability. ITEN’s batteries are free from hazardous materials, providing a safer, eco-friendly alternative. By enabling longer device life and reducing the need for external power components, this innovation contributes to minimizing electronic waste.
Industry Collaboration and Future Prospects
This achievement marks the beginning of a new era in packaging innovation, especially for 3D chip integration architectures with built-in energy sources. ITEN and A*STAR IME are actively exploring future applications in consumer electronics, medical devices, and IoT solutions, where compactness and energy efficiency are critical.
“We are pleased to collaborate with ITEN to develop breakthrough advanced packaging technologies that meet the needs of the growing microelectronics market. Such efforts will enable new applications of SiP, creating new market opportunities,” said Terence Gan, Executive Director of A*STAR IME.
Vincent Cobee, CEO of ITEN, added, “A*STAR IME’s strong knowledge and expertise in advanced packaging technologies support us in accelerating the development of new micro batteries optimized for integration into SiP. This is a major step forward in addressing the challenges of energy efficiency across a wide spectrum of applications.”
Leader in Advanced Packaging Research
A*STAR IME’s research is centered around three architecture families: high density fan-out wafer-level packaging (HD FOWLP), 2.5D interposer and 3D interposer, from which eight platforms are derived: mold-first FOWLP, redistribution layer (RDL)-first FOWLP, passive interposer, active interposer, photonic interposer, wafer-to-wafer (W2W) hybrid bond, chip-to-wafer (C2W) hybrid bond, and C2W micro-bump. A*STAR IME also develops manufacturing techniques, packaging architectures, electrical-thermal-mechanical (ETM) models, and package process design kits (PDK) advancing the industry’s packaging roadmap.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
ASMPT Announces Gordon Lam as Chief Commercial Officer for SEMI Solutions
09/08/2025 | ASMPTASMPT, the world's leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced the appointment of Mr. Gordon Lam as Chief Commercial Officer for Semiconductor Solutions (SEMI Solutions).
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs:
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
Koh Young Hosts First Technical Review Meeting at New Taiwan Office to Showcase Advanced Metrology and Inspection Solutions
09/01/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is inviting semiconductor and SMT professionals to its first Technical Review Meeting at the newly opened Koh Young Taiwan (KYTW) office in Zhubei City.