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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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OSI Systems Receives $7 Million Order for Medical Technology Components
May 13, 2025 | BUSINESS WIREEstimated reading time: Less than a minute
OSI Systems, Inc. announced that its Optoelectronics and Manufacturing division has been awarded an order for approximately $7 million to supply essential components for a leading healthcare innovator specializing in patient diagnostic and care applications.
Ajay Mehra, OSI Systems’ President and Chief Executive Officer, commented, "We are thrilled to capture this order from this long-term customer and look forward to supporting their leading medical solutions."
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Punching Out: Your Financial Preparation for a Sale
05/07/2025 | Tom Kastner -- Column: Punching Out!When preparing for a sale, it’s important to clean up the financials as much as possible. The fewer questions and the less that needs to be explained, the easier it is to get through due diligence without slowing things down or creating mistrust. Here are the main things that are relatively easy to clean up.
OSI Systems Receives Orders for $50 Million to Support the Deployment of Cargo and Vehicle Inspection Solutions
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NCAB Acquires 100% of B&B Leiterplattenservice GmbH in Germany
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Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.